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Thermal Clad and Metal Backed Printed Circuits

In today’s industry, electronics are required to output more power generating more heat resulting in a shorter lifespan of the circuit.  Omega Circuits and Engineering has been combating this by building circuits on material other than standard FR4. 

Omega offers  thermal clad on Aluminum. Which acts as a heat sink by dissipating heat and adding overall strength and durability to the circuit.  Manufacturing on these substrates has proven to lower core temps and Coefficients of Thermal Expansion or COE.


If you are experiencing field failure in your current circuit boards or would just like to add the upgraded performance to your boards, contact us today and have your PCB designed and built on a thermal clad substrate! 


Reduce Thermal Expansion

Thermal Clad Printed Circuit Board – Applications


  • LED's
  • Power Converters
  • Amplification Systems
  • Motor Drives
  • Automotive
  • Solid State Relays
Thermal Clad PCB Material Include But Not Limited To
  • Bergquist
  • Laird Technologies
  • Arlon/Rogers

There are many different designs to lower the heat signature of your circuit design.  Heat generated by the IC is transferred from the device to the copper layers of the PCB. The ideal thermal design will result in the entire board being the same temperature. The copper thickness, number of layers, continuity of thermal paths, and board area will have a direct impact on the operating temperature of components.  By plating heavier copper traces you can also lower operating temps by creating heat sink tracing.  Heat convection can be optimized by ensuring multiple heat and high current routes.  These routes can include the use of more layers of solid ground or power planes connected directly to heat sources with multiple vias.  The combination of thermal clad materials, heavy copper tracing, and thermal vias have proven to be effective in combating thermal pcb management.

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